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The Materials Research Center is well served
with equipment for processing and characterization of the
materials. The equipment listed could either be central facilities
(marked CF) or associated with the laboratories of individual
faculty members. {Prof. S. B. Krupanidhi (SBK), Prof. K.B.R.
Varma (KBR), Prof. S. A. Shivashankar (SAS), Prof. Arun M.
Umarji (AMU), Dr. N. Ravishankar (NR), Dr. K. K. Nanda (KKN)
and Dr. Srinivasan Raghavan (SR)}. Apart from departmental
facilities the students also have access to institute and
national facilities such as the characterization facilities
in the Institute Nano-Science Initiative.
PROCESSING EQUIPMENT
- Molecular Beam Epitaxy: MBE system
from Omicron NanoTechnology, having 6 different effusion
cells (for Ga, In, Al, As, Zn, Si ) and N2 plasma source,
equipped with in-situ RHEED (Reflection High Energy Electron
Diffraction) and variable temperature STM (Scanning Tunneling
Microscope) and AFM (Atomic Force Microscope) (SBK).
- Laser for pulsed laser deposition of thin films:
Lambda Physik COMPex series 201 and 102 Excimer Laser
coupled to 3 multi-target ablation chambers for growth
of complex oxide thin films and artificial superlattices
(SBK).
- Metal organic chemical vapor deposition reactor:
MOCVD (CVD Corp.) reactor for growth of GaAs based solar
cells heterostructures (SBK).
- RF Sputtering system/Multi-Magnetron DC sputtering
system (SBK).
- Thermolyne High Temperature Furnace:
Muffle furnace with a maximum operating temperature of
1700°C. (KBR)
- Lenton Glass Melting Furnace: Maximum
operating temperature 1700°C. (KBR)
- Induction furnace: (KBR)
- Czochralski single crystal puller: (KBR)
- Atomic Layer Deposition System (ALD):
The system is a multi channel (5 channels), multi gas
(N2, O2, H2, and Ar) low pressure state of the art atomic
layer CVD deposition system built indigenously. The system
has two cold-wall deposition reaction chambers viz. vertical
and horizontal. The substrate temperatures are achieved
by localized susceptor heating. The gas control and purge
sequences are all computer controlled, electronically
interfaced and actuated by pneumatic valves. The multi
channel configuration allows doping and performing complex
compound reactions with 5 different chemical complexes
in a single deposition process (SAS).
- Chemical vapor deposition systems: The
laboratory is equipped with four low-pressure, hot-wall,
horizontal CVD systems, all of which are dual channel
permitting any type of doping in a deposition process.
Of the four units, each unit is currently dedicated to
a particular chemical system viz. Titanium Di-oxide, Vanadium
Oxides, Manganese Oxide and Alumina.(SAS)
- Chemical synthesis laboratory: The
CVD of compounds requires metal-organic chemical precursors,
for which the SAS lab relies on its own synthesis laboratory.
The laboratory is fully equipped with all the facilities
for chemical synthesis of metal-organic compounds.(SAS)
- Electro-deposition systems: The laboratory
has 2 electro-deposition systems for depositing metal
electrodes like Aluminum, Gold etc. for making electrical
contacts. (SAS)
- Microwave oven (800 watts): The microwave
oven is used to synthesize nanostructured compounds by
microwave assisted heating of metal-organic complexes.(SAS)
- Thermal Evaporator: The Thermal Evaporator
evaporates and deposits metal onto substrates. Under vacuum,
current is passed through a filament boat, which heats
up the metal contained on the boat. When the evaporation
current is reached, the melted metal evaporates onto the
substrate.(AMU)
- Hot uniaxial Press: (AMU)
- Vacuum Furnace: Horizontal tube furnace
capable of continuous operation at 1100°C and 10-3
Torr pressure (NR)
- High Temp Furnace: Horizontal tube
furnace with silicon carbide elements capable of continuous
operation in air at 1600°C. (NR)
- Two Lenton horizontal tube furnaces: Capable
of 1100°C and 1500°C maximum operating temperature.
(KKN)
- CVD Reactor: Indigenously built CVD
reactor for synthesis and studying crystal growth of group
III-A nitride and other semiconductor nanowires and micro-crystals.
(SR, under construction)
- Ball Mill
Top
CHARACTERIZATION
EQUIPMENT
STRUCTURAL CHARACTERIZATION:
- Olympus visible light microscope with CCD camera attachment:
Two such facilities are available in the department. One
as part of the central facility and one with Dr. N. Ravishankar
- Cambridge scanning electron microscope with EDAX attachment
(CF)
- Jeol200CX Transmission electron microscope (CF)
- Phillips powder x-ray diffractometer (CF)
- Scintag high temperature x-ray diffractometer (CF)
SURFACE CHARACTERIZATION:
ELECTRICAL CHARACTERIZATION:
- Impedance Analyzer (Agilent Technologies - 4294A) (SBK)
- Radiant Technologies Precision Workstation, LCZ Meter
(Keithley - 3330) (SBK),
- SMU (Keithley - Model 236) (SBK)
- Noise measurement using Stanford Research Systems model
770 Network Analyzer and Model 560 dual-channel Voltage
Preamplifier. (SBK)
- Impedance/Gain phase analyzer (HP 4194A) Frequency
range 100Hz-40MHz (KBR)
- LCZ meter: Keithley 3330 (KBR)
- Automated Pyroelectric measurement setup used the find
out the TSDC (Temperature Stimulated Depolarization current)
and Pyroelectric current (KBR)
- Keithley Picoammeter (KBR)
- d33 meter (KBR)
- Sawyer Tower Ferroelectric Hysteresis loop measurement
setup (Home
made) (KBR)
OPTICAL CHARACTERIZATION:
- Low Temperature Photoluminescence measurement
system (8 K to 400 K) (SBK)
- Electro-optic setup: The setup is
used to find out the Electro optic coefficient of a material.The
electro-optic effect is the modification of the refractive
index of a medium, caused by an electric field. Only non-centrosymmetric
crystal materials exhibit the linear electro-optic effect,
also called Pockels effect, where the refractive index
change is proportional to the electric field strength.
Basically all other transparent media exhibit only the
Kerr electro-optic effect, where the refractive index
change is proportional to the square of the electric field
strength, and is typically much weaker than for the linear
effect. Materials exhibiting the Pockels effect are called
electro-optic materials. The linear electro-optic effect
is exploited in Pockels cells, which can be part of electro-optic
modulators, and for electro-optic sampling. (KBR)
- Hitachi U-3000 spectophotometer: UV-Visible
range. (KBR)
- Field emission testing setup: Indigenously
fabricated set up for studying field emission in nanowires.
Vacuum chamber can be pumped down to 10-6 Torr. (KKN)
THERMAL CHARACTERIZATION:
- Differential Scanning Calorimeter:
Perkin-Elmer power compensating DSC capable of operating
up to 700°C. (KBR)
- Thermal analysis cluster consisting of a DTA/TGA
and DSC: (CF)
- High temperature thermal conductivity measurement
setup: Home-built apparatus for measuring thermal
conductivity value of small samples 1mm x1mmx10mm based
on the parallel conductance technique from room temperature
to 700 K. The same apparatus can also be used to measure
the Seebeck coefficient of a material without disturbing
the physical mounting.(AMU)
- High Temperature Dilatometer: Home-built
instrument for measuring the dimensional change caused
by subjecting a sample to a change in temperature.(AMU)
MECHANICAL CHARACTERIZATION:
Instron Universal Testing Machine
(UTM): UTM machine designed for testing various materials
like rubber, plastics, cables, leather, paper, plywood and
metals. Tension, compression, bend and flexural tests can
be performed with suitable grips and fixtures.(CF)
MAGNETIC CHARACTERIZATION:
Vibration sample magnetometer(VSM):
The VSM is used to measure the magnetic properties of material.
For more information visit http://www.dms-magnetics.com/pdf/vsmmost.pdf.
(CF)
OTHERS:
Gas Sensing Apparatus:
Home-built gas sensing setup to measure the response of thin
film sensors to various gases and liquid vapors. This is used
for inflammable gases, toxic gases, and pollutants, and for
liquid vapors such as alcohol and flammable organic liquids.
The electrical resistance of the thin film varies with change
in the concentration of the gas being sensed, and thus gas
concentrations can be measured. These measurements can be
done up to 500°C. (AMU)
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